Sign In | Join Free | My china-telecommunications.com
China Unicomp Technology logo
Unicomp Technology
Verified Supplier

9 Years

Home > Electronics X Ray Machine >

Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution

Unicomp Technology
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution

  • 1
  • 2

Model Number : AX8300MAX

Tube Type : Sealed

MOQ : 1Set

Delivery Time : 30 days

Power Consumption : 900W

Payment Terms : T/T,L/C

Motion Control Mode : Mouse & Keyboard & Joystick

System OS : Windows11 64-bit

Price : can negotiate

Tilt and Rotation : Detector unilateral tilt maximum 60°

Monitor : 27"HD 4K display

Supply Ability : 30 sets per month

Model : AX8300MAX

Brand Name : UNICOMP

Certification : CE, FDA

Place of Origin : China

Packaging Details : Wooden Case, Waterproof, Anti-collision

Contact Now

Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP
This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces.
Applications
Quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection molding plastic assemblies, ceramic structural components and other special industrial workpieces.
Key Features
  • Dedicated hardware configurations optimized for precision electronic inspection
  • Ultra-high 5μm detection resolution for precise capture of micro internal defects
  • Wide-coverage detection field supporting efficient batch inspection
  • High-precision dual-rocker mechanical control system for flexible positioning
  • Compatible with standard 2D flaw scanning and 2.5D contour detection
  • Expandable interfaces for 3D detection upgrade
  • Dual-screen interactive operation design for multi-task parallel operation
  • Professional AI detection algorithms for automatic identification of common internal defects
Technical Specifications
Product Name AX8300MAX
Dimension 1286(W)*1540(D)*1700(H)[mm]
Machine Weight 1530kg
Power Supply 220V±10% 50Hz/60Hz 4A
Detector High resolution FPD
Voltage 110kV
Power 900w
Tube Type Sealed
Max. Power 25W
Detection Area 129*129[mm]
Pixel Matrix 1536*1536[pixel]
Frame Rates Max 30fps
Geometric Magnification 47.7X
Functions and Features
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution
Inspection Images
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution
Dimensions and Appearance
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution
Frequently Asked Questions
What's your packaging solution? Will the equipment stay intact during transit?
All X-ray inspection systems are securely packed in standard solid wooden cases to guarantee safe transportation.
What is your warranty policy and after-sales support?
We offer a 1-year warranty covering free spare parts replacement, alongside lifetime technical support. Our dedicated after-sales team is on standby; operation tutorial videos will also be provided to resolve any operational issues.
Can we receive free training if we visit your factory?
Absolutely. You are cordially invited to our manufacturing plant, and we will arrange full free professional training for your team.
Our Services
  • Conduct project analysis and customize targeted non-destructive inspection solutions
  • Deliver full-spectrum professional testing schemes tailored to diverse industrial demands
  • Offer professional fixture customization supported by experienced engineering team
  • Provide 24-hour email response service for all client inquiries
  • Support complimentary sample inspection testing
  • Supply real-time shipment tracking & logistics information verification
  • Cover 1-year standard warranty and lifelong technical maintenance service

Product Tags:

Semiconductor BGA X-ray inspection machine

      

Flip Chip X-ray machine 5μm resolution

      

UNICOMP X-ray machine with warranty

      
Quality Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution for sale

Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Unicomp Technology
*Subject:
*Message:
Characters Remaining: (0/3000)